Product System
- Micro Ball Attach and Reflow Automation
- Inner Layer Inline Automation
- Outer Layer Inline Automation
- Solder Mask Inline Automation
- Pretreatment, Lamination, LDI Inline Automation
- Surface Layer Inline Automation
- Core Layer Inline Automation
Micro Ball Attach and Reflow Automation
Micro Ball Attach and Reflow Automation
Specifications:
1)Reduce material waiting/idle time and improve ef₹ficiency.
2)Reduce handling of material, and improve handling risks and quality.
3)Processes of different clean room environment can be connected, improve process yield.
4)MES ready with PC communication, and CCTV monitoring.